|
|
|
 |
| 14PIN BF CERAMIC PKG |
|
|
|
| Design and Analysis |
|
* High Frequency Design
* Thermal Management Design
* High Frequency Simulation and Analysis HFSS,MDS
* Thermal Simulation and Analysis
|
| Process Technologies |
|
* Thin Film Metallization: Au,Ni,Mo,Ti,Pt
* Passive Components lntegration
* Ball Lens Attachment
* hermetic Glass Sealing with High Thermal Comducting Materials
* Feed thru Terminal: Ceramic Or Glass-Sealed
|
| Material technologies |
|
* Metal Matrix
* CuW,CuMo,Kovar,Stainless,42 FeNi
* Advanced Ceramics
|
| Application |
|
* Butterfly Type Module
* Semiconductor Optical Amplifier SOA,SLED
* Pump Laser Module
* Butterfly Type Module
|
| Appearance & Dimension |
|
NO
|
PART NAME
|
MATERIAL
|
|
1
|
CASE
|
KOVAR
|
|
2
|
BASE
|
Cu-W20
|
|
3
|
PIPE
|
KOVAR
|
|
4
|
LEAD
|
KOVAR
|
|
5
|
GLASS
|
BH-A
|
|
6
|
BRAZING
|
JIS Bag-8(EQUIVALENT)
|
|
|
|
|
|
|
|
|
|
|
 |
| 14PIN BF GLASS PKG |
|
|
|
| Design and Analysis |
|
* High Frequency Design
* Thermal Management Design
* High Frequency Simulation and Analysis HFSS,MDS
* Thermal Simulation and Analysis
|
| Process Technologies |
|
* Thin Film Metallization: Au,Ni,Mo,Ti,Pt
* Passive Components lntegration
* Ball Lens Attachment
* hermetic Glass Sealing with High Thermal Comducting Materials
* Feed thru Terminal: Ceramic Or Glass-Sealed
|
| Material technologies |
|
* Metal Matrix
* CuW,CuMo,Kovar,Stainless,42 FeNi
* Advanced Ceramics
|
| Application |
|
* Butterfly Type Module
* Semiconductor Optical Amplifier SOA,SLED
* Pump Laser Module
* Butterfly Type Module
|
| Appearance & Dimension |
|
NO
|
PART NAME
|
MATERIAL
|
|
1
|
CASE
|
KOVAR
|
|
2
|
BASE
|
Cu-W20
|
|
3
|
PIPE
|
KOVAR
|
|
4
|
LEAD
|
KOVAR
|
|
5
|
GLASS
|
BH-A
|
|
6
|
BRAZING
|
JIS Bag-8(EQUIVALENT)
|
|
 |
|
|
|
|
|
