Semiconductor Silicon Wafers 
 
Specifications: Nowadays, we are maily specializing in the following two kinds of specification.

FZ(NTD)Lapped Wafer
Dia.&tolerance(mm) 76.2±0.2
Type/Dopant N-type/NTD
Orientation <111>
Resistivity(Ω•cm) 30-150
ORG(%) <8
Oxygen Content(at cm-3) ≤1*1016
Carbon Content(at cm-3) ≤2*1016
Thinckness tolerance(μm) As per customer spec.
TTV(μm) ≤6
BOW(μm) ≤25

CZ Lapped Wafer
Dia.&tolerance(mm) 76.2±0.2
Type/Dopant N-type/Phosphorus
Orientation <111>
Resistivity(Ω•cm) 10-60
ORG(%) <15%
Oxygen Content(at cm-3) ≤1*1017
Carbon Content(at cm-3) ≤5*1016
Thinckness tolerance(μm) As per customer spec.
TTV(μm) ≤6
BOW(μm) ≤25

 
Advantages: Being an actual manufacturer, we have been distributed our products worldwide; we enable to guarantee you the production to excellent quality, reasonable price and delivery on time. The list of finished products and glass blocks in stock are available upon requested.
 
 
Product Description
 
As a professional producer of silicon wafer in China, we offer the most cutting-edge technologies and expert service to satisfy your various needs with our competitive prices. All silicon wafers can be made according to your requirement in a variety of grades.